IDC Technical Brief: Enabling Technologies for Power and Cooling

Overview

In June 2006, Hewlett-Packard (HP) announced its next-generation blade portfolio, the BladeSystem c-Class, which addresses some of the total cost of ownership (TCO) issues that typify high-density computing environments. Among the concerns addressed by HP's newest line of blade servers is the need to manage power and cooling at the rack level. This IDC Technical Brief discusses this issue at length and explains how HP Thermal Logic technologies, introduced with the BladeSystem c-Class portfolio, can help manage and optimize power and cooling resources in high-density data centers.