Overview
In this case study, three embedded Intel Architecture components form the foundation for two entirely different processing platforms: one for a mobile application, the other for a telecom storage application. This case study explains how the Intel Pentium M processor, Intel 855GME chipset, and Intel 6300ESB I/O controller hub help ADLINK deliver high-performance, low-power modular platforms for extremely fast time-to-market in two very different solutions.
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