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Title Date Added Company

Carbon Nanotube Bumps for Thermal and Electric Conduction in Transistor 2007-10-01 Fujitsu

The continuous miniaturization of semiconductor chips has rapidly improved the performance of semiconductor products. However, thermal issues that affect semi- conductor chips are becoming more serious. For example, heat transfer has become a very serious problem in the CPUs of personal computers; high-frequency High-Power Amplifiers (HPAs) of mobile communication systems; and power control units of hybrid-car motors. To solve this problem, Fujitsu has been developing semi-conductor heat sinks that exploit the high thermal conductivity of Carbon NanoTubes (CNTs). This paper describes the CNT bumps that have been recently developed for transferring heat and electrically connecting the source, gate, and drain of the high-power, flip-chip amplifiers of mobile communication base stations.

Tags: Mobile - Wireless Communications

Quantum?Dot?Based Photonic Devices 2007-10-01 Fujitsu

Adopting nanometer-sized semiconductor particles, called quantum dots, in the active regions of photonic devices provides the characteristics specific to 3-dimensional quantum effects. This will greatly improve the performance of photonic devices in many respects. This paper is developing quantum-dot lasers and quantum-dot optical amplifiers through joint research conducted with the University of Tokyo. This paper introduces the development of technology for these devices, along with some recent results. For quantum-dot lasers, one has realized temperature-insensitive direct modulation at a modulation rate of 10 Gb/s in the 1.3-?m wavelength range. The paper has also fabricated high-performance, quantum-dot optical amplifiers with a wide bandwidth of over 100 nm, high gain of 20 dB, and high optical output power of over +20 dBm.

Innovative Manufacturing Activities in Fujitsu Group Plants 2007-01-01 Fujitsu

Fujitsu initiated innovative manufacturing activities company-wide in 2003, and is now promoting innovative activities at each plant under the guidance of a consultant for the Toyota Production System (TPS). This paper describes the innovative manufacturing activities undertaken at Fujitsu Component Limited (FCL), and then introduces Fujitsu IT Products Limited (FJIT) and the Fujitsu Nasu Plant (mobile system manufacturing), which are promoting innovative activities that began in April 2004 at their facilities under TPS consultant guidance. Finally, this paper examines related activities under way at Shimane Fujitsu Limited (SFJ), which has received guidance from a TPS consultant since April 2005.

Tags: IT Manufacturing

RoHS Compliance at Intel 2006-12-22 01:00:22 Intel

The Restriction of the Use of Certain Hazardous Substances (RoHS) Directive is a European Union (EU) directive that seeks to minimize the use of certain hazardous substances in Electrical and Electronic Equipment (EEE). As a world leader in the EEE industry, Intel is committed to adhering to RoHS requirements. This white paper specifically addresses RoHS requirements as they pertain to Intel's telecommunication board and system-level products.

Benchmarking Nanotechnology for High-Performance and Low-Power Logic Transistor Applications 2006-12-23 01:00:24 IEEE

There has been tremendous progress made in the research of novel nanotechnology for future nanoelectronic applications. In particular, several emerging nanoelectronic devices such as carbon-nanotube Field-Effect Transistors (FETs), Si nanowire FETs, and planar III - V compound semiconductor (e.g., InSb, InAs) FETs, all hold promise as potential device candidates to be integrated onto the silicon platform for enhancing circuit functionality and also for extending Moore's Law. For high-performance and low-power logic transistor applications, it is important that these research devices are frequently benchmarked against the existing Si logic transistor data in order to gauge the progress of research. In this paper, the author uses four key device metrics to compare these emerging nanoelectronic devices to the state-of-the-art planar and nonplanar Si logic transistors.

Importance of an Open System Architecture in the Semiconductor Industry 2005-09-01 03:00:04 Northrop Grumman

The semiconductor industry has historically been an extremely dynamic, high-growth industry, with new device technologies being brought to market every day. That environment has prompted the rapid emergence and maturation of many application-specific processing tools and software solutions to meet manufacturing and time-to-market requirements. This paper describes the underlying architecture of the Semiconductor Computer-Integrated Manufacturing (CIM) Framework, its application to MESs, several implementation approaches with legacy MESs, and TRW's Integrated Manufacturing Solutions' approach to a CIM Framework-compliant MES.

The Science of Cable Design, Part II 2004-11-01 14:54:40

In Part I, we measured the frequency linearity of various cable designs using TARA Labs' Constant Current Impedance Testing (CCZT). Why do different conductor types of the same mass yield such different results? In a few words: electromagnetic flux linkage.

Managing Risk in Block Based Designs: A Front End Acceptance Methodology 2006-04-25 03:55:29 Cadence Design Systems

It has recently become commonly accepted knowledge that System on Chip designs are tending to use more and more pre-built IP blocks as the most common way to achieve more reuse and faster time to markets. However, as most designers who have attempted this approach, will substantiate, this approach has lots of pitfalls and unforeseen risks. This paper outlines a very formal, step-by-step process or methodology by which design specifications as well as component blocks are analyzed for correctness, completeness and feasibility even before the design is started. This process is used as a way to quantify risk very early in the design phase. Having analyzed the data and understood the risks, design teams will be better suited to improve predictability.

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Title	Date Added	Company
Carbon Nanotube Bumps for Thermal and Electric Conduction in Transistor	2007-10-01	Fujitsu
The continuous miniaturization of semiconductor chips has rapidly improved the performance of semiconductor products. However, thermal issues that affect semi- conductor chips are becoming more serious. For example, heat transfer has become a very serious problem in the CPUs of personal computers; high-frequency High-Power Amplifiers (HPAs) of mobile communication systems; and power control units of hybrid-car motors. To solve this problem, Fujitsu has been developing semi-conductor heat sinks that exploit the high thermal conductivity of Carbon NanoTubes (CNTs). This paper describes the CNT bumps that have been recently developed for transferring heat and electrically connecting the source, gate, and drain of the high-power, flip-chip amplifiers of mobile communication base stations. Tags: Mobile - Wireless Communications
Quantum?Dot?Based Photonic Devices	2007-10-01	Fujitsu
Adopting nanometer-sized semiconductor particles, called quantum dots, in the active regions of photonic devices provides the characteristics specific to 3-dimensional quantum effects. This will greatly improve the performance of photonic devices in many respects. This paper is developing quantum-dot lasers and quantum-dot optical amplifiers through joint research conducted with the University of Tokyo. This paper introduces the development of technology for these devices, along with some recent results. For quantum-dot lasers, one has realized temperature-insensitive direct modulation at a modulation rate of 10 Gb/s in the 1.3-?m wavelength range. The paper has also fabricated high-performance, quantum-dot optical amplifiers with a wide bandwidth of over 100 nm, high gain of 20 dB, and high optical output power of over +20 dBm.
Innovative Manufacturing Activities in Fujitsu Group Plants	2007-01-01	Fujitsu
Fujitsu initiated innovative manufacturing activities company-wide in 2003, and is now promoting innovative activities at each plant under the guidance of a consultant for the Toyota Production System (TPS). This paper describes the innovative manufacturing activities undertaken at Fujitsu Component Limited (FCL), and then introduces Fujitsu IT Products Limited (FJIT) and the Fujitsu Nasu Plant (mobile system manufacturing), which are promoting innovative activities that began in April 2004 at their facilities under TPS consultant guidance. Finally, this paper examines related activities under way at Shimane Fujitsu Limited (SFJ), which has received guidance from a TPS consultant since April 2005. Tags: IT Manufacturing
RoHS Compliance at Intel	2006-12-22 01:00:22	Intel
The Restriction of the Use of Certain Hazardous Substances (RoHS) Directive is a European Union (EU) directive that seeks to minimize the use of certain hazardous substances in Electrical and Electronic Equipment (EEE). As a world leader in the EEE industry, Intel is committed to adhering to RoHS requirements. This white paper specifically addresses RoHS requirements as they pertain to Intel's telecommunication board and system-level products.
Benchmarking Nanotechnology for High-Performance and Low-Power Logic Transistor Applications	2006-12-23 01:00:24	IEEE
There has been tremendous progress made in the research of novel nanotechnology for future nanoelectronic applications. In particular, several emerging nanoelectronic devices such as carbon-nanotube Field-Effect Transistors (FETs), Si nanowire FETs, and planar III - V compound semiconductor (e.g., InSb, InAs) FETs, all hold promise as potential device candidates to be integrated onto the silicon platform for enhancing circuit functionality and also for extending Moore's Law. For high-performance and low-power logic transistor applications, it is important that these research devices are frequently benchmarked against the existing Si logic transistor data in order to gauge the progress of research. In this paper, the author uses four key device metrics to compare these emerging nanoelectronic devices to the state-of-the-art planar and nonplanar Si logic transistors.
Importance of an Open System Architecture in the Semiconductor Industry	2005-09-01 03:00:04	Northrop Grumman
The semiconductor industry has historically been an extremely dynamic, high-growth industry, with new device technologies being brought to market every day. That environment has prompted the rapid emergence and maturation of many application-specific processing tools and software solutions to meet manufacturing and time-to-market requirements. This paper describes the underlying architecture of the Semiconductor Computer-Integrated Manufacturing (CIM) Framework, its application to MESs, several implementation approaches with legacy MESs, and TRW's Integrated Manufacturing Solutions' approach to a CIM Framework-compliant MES.
The Science of Cable Design, Part II	2004-11-01 14:54:40
In Part I, we measured the frequency linearity of various cable designs using TARA Labs' Constant Current Impedance Testing (CCZT). Why do different conductor types of the same mass yield such different results? In a few words: electromagnetic flux linkage.
Managing Risk in Block Based Designs: A Front End Acceptance Methodology	2006-04-25 03:55:29	Cadence Design Systems
It has recently become commonly accepted knowledge that System on Chip designs are tending to use more and more pre-built IP blocks as the most common way to achieve more reuse and faster time to markets. However, as most designers who have attempted this approach, will substantiate, this approach has lots of pitfalls and unforeseen risks. This paper outlines a very formal, step-by-step process or methodology by which design specifications as well as component blocks are analyzed for correctness, completeness and feasibility even before the design is started. This process is used as a way to quantify risk very early in the design phase. Having analyzed the data and understood the risks, design teams will be better suited to improve predictability.