| Title | Date Added | Company | |
|---|---|---|---|
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AMD Unveils IT Industry's First Virtual Technology Expo | 2007-10-01 | Advanced Micro Devices (AMD) |
| This virtual tradeshow from AMD combines the best aspects of a physical tradeshow with 3D technology and the interactivity of the Web. Listen to keynote addresses from senior executives of HP, Oracle, Dell, VMware, and AMD to learn how Quad-Core AMD Opteron processors are changing the contemporary technology landscape.
Tags: Components, Components, Software Development Tools, Components, Internet and Web |
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Quantum?Dot?Based Photonic Devices | 2007-10-01 | Fujitsu |
| Adopting nanometer-sized semiconductor particles, called quantum dots, in the active regions of photonic devices provides the characteristics specific to 3-dimensional quantum effects. This will greatly improve the performance of photonic devices in many respects. This paper is developing quantum-dot lasers and quantum-dot optical amplifiers through joint research conducted with the University of Tokyo. This paper introduces the development of technology for these devices, along with some recent results. For quantum-dot lasers, one has realized temperature-insensitive direct modulation at a modulation rate of 10 Gb/s in the 1.3-?m wavelength range. The paper has also fabricated high-performance, quantum-dot optical amplifiers with a wide bandwidth of over 100 nm, high gain of 20 dB, and high optical output power of over +20 dBm. | |||
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Carbon Nanotube Bumps for Thermal and Electric Conduction in Transistor | 2007-10-01 | Fujitsu |
| The continuous miniaturization of semiconductor chips has rapidly improved the performance of semiconductor products. However, thermal issues that affect semi- conductor chips are becoming more serious. For example, heat transfer has become a very serious problem in the CPUs of personal computers; high-frequency High-Power Amplifiers (HPAs) of mobile communication systems; and power control units of hybrid-car motors. To solve this problem, Fujitsu has been developing semi-conductor heat sinks that exploit the high thermal conductivity of Carbon NanoTubes (CNTs). This paper describes the CNT bumps that have been recently developed for transferring heat and electrically connecting the source, gate, and drain of the high-power, flip-chip amplifiers of mobile communication base stations.
Tags: Mobile and Wireless |
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Avoiding Costly Product Recalls With Proactive SPC | 2007-09-13 | |
| This year alone, consumer confidence has been shaken over product quality, reliability and safety concerns within the food processing, electronics, automotive, toy, clothing and personal care industries. The next "Shoe" is just waiting to fall. Conservatively speaking, if one's business is effected, expect to spend more than a million dollars responding to a recall. While analysts and consultants urge companies to have an actionable crisis management plan in place, Zontec contends that it is possible to prevent a recall situation well before a product ever approaches crisis mode. Betting on recall and/or contamination insurance isn't enough. Because as soon as a product's reputation becomes publicly suspect, the rebuilding of brand equity and lost market share becomes an absolute financial, legal, public relations and logistics nightmare. | |||
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Bringing USB to the Network | 2007-09-09 | MosChip Semiconductors |
| USB technology has changed the PC peripheral industry ever since the introduction of USB 1.1 in September 1998 and then later USB 2.0 in April 2000. USB interface was initially intended to retire serial and parallel ports by creating a universal interface for serial / parallel devices, it has quickly gained acceptance as the standard interface for a wide variety of devices including keyboards, mice, game pads, scanners and printers. High-speed USB2.0, with its 480 Mbps speeds, proliferated mass storage devices with ever increasing capacities and gave capabilities to connect a standard IDE/SATA hard drive to the PC. USB also spread outside the PC to PDA's, and portable devices.
Tags: Management, Components |
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Intel Technology Moment podcast: Mobility | 0000-00-00 | Intel |
| Learn more about Intel Centrino Pro technology with Mike Agerbo of "Get Connected TV" and how this technology will help you to stay connected and productive.
Tags: Components, Enterprise Planning, Components, Handhelds |
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Infineon Singapore Standardizes on Network Appliance for High-Growth, Semiconductor R&D Environment | 0000-00-00 | NetApp |
| For Infineon Singapore, staying on top in the semiconductor industry means continually fine-tuning the company's IT infrastructure to keep pace with rapid growth. Storage capacity requirements, for example, have doubled in each of the last three years. Faced with ever-greater chip complexity, a constantly increasing number of projects, and an expanding corporate presence in Singapore, Infineon's continued success require the ability to rapidly support multidimensional growth. Working with NetApp partner PTC System(s) Pte Ltd, Infineon deployed clustered NetApp Fabric-Attached Storage (FAS) systems and NearStore systems at each of two Infineon facilities in Singapore.
Tags: Management, Components |
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Chartered Semiconductor Upgrades ERP Platform in Seven Months for Global Rollout | 2007-07-01 | Oracle |
| Singapore-based Chartered Semiconductor Manufacturing is one of the world's leading semiconductor foundries, with five wafer fabrication facilities capable of producing approximately two million eight-inch equivalent wafers annually. An Oracle customer since 1996, Chartered upgraded to the latest version of Oracle E-Business Suite in February 2007. This was the first major upgrade since the initial implementation of the software seven years ago. To ensure the deployment could be completed smoothly to meet a number of fixed internal deadlines, the company engaged Oracle Consulting to oversee the project. A 50-person team comprising of Oracle Consulting and Chartered staff was able to upgrade the existing platform, implement new modules, reengineer business processes, and simplify the heavily customized environment in time for the planned go-live date.
Tags: Data Infrastructure, Components |
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IBM engineers advanced supply chain management solution for Analog Devices Inc. | 2006-03-28 | IBM |
| New solution delivers improved performance and helps ADI predict supply versus demand.
Tags: IT Budgeting, Customer Management, Components, Business Functions, Business Functions, IT Budgeting |
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A Flexible Architecture to Drive Sharp Two-Way Viewing Angle and Standard LCDs | 2007-03-01 | Altera |
| One of the most common elements in the consumer and automotive electronics is the Liquid Crystal Display (LCD). LCD technology has produced a large array of products that meet a wide range of size, power, and image quality requirements. Recent innovation from Sharp Electronics goes one step further with the development of a two-way viewing angle LCD product. The popularity of standard LCDs has led to a number of semiconductor solutions to drive them, ranging from ASSPs to full-custom devices. In the case of two-way viewing LCD products, no standard driver solution exists, so a custom solution is required to support them. This paper discusses an innovative architecture based on FPGAs and soft-core embedded processors that supports both standard and two-way viewing LCD products.
Tags: Components |
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