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 TitleDate AddedCompany
whitepaper IBM System z9 eFUSE Applications and Methodology2007-02-13 IBM
  IBM System z9 is the first zSeries product to use electronic FUSEs (eFUSEs). The blowing of the fuse does not involve a physical rupture of the fuse element, but rather causes electromigration of the silicide layer, substantially increasing the resistance. The fuse is ''Blown'' with the application of a higher-than-nominal voltage. eFUSEs provide several compelling advantages over the laser fuses they have replaced. The blow process does not risk damage to adjacent devices. eFUSEs can be blown by a logic process instead of a physical laser ablation method. eFUSEs are substantially smaller than laser fuses, and they scale better with process improvements. This paper discusses circuit design, fuse programming, test considerations, and z9 system applications.

Tags: Components		   
whitepaper GTI Technologies Looks to CRM to Build a Bright Future0000-00-00 Microsoft
  GTI Technologies, Inc. is a leading distributor of innovative manufacturing equipment for companies in the semiconductor, materials, and metalworking industries. The company realized it needed a way to improve access to its critical sales and customer data - and sought out a customer relationship management solution. After thoroughly evaluating many solutions, GTI chose Microsoft CRM (now part of Microsoft Dynamics). Working with Infinity Info Systems, a New York-based Microsoft Certified Business Solutions Partner, GTI implemented Microsoft CRM, running on the Microsoft Windows Small Business Server 2000 operating system. GTI quickly began reaping the rewards, including improved access to customer and project data, streamlined communications, and enhanced positioning for future sales and growth.

Tags: Customer Management, Components		   
whitepaper Innovative Manufacturing Activities in Fujitsu Group Plants2007-01-01 Fujitsu
  Fujitsu initiated innovative manufacturing activities company-wide in 2003, and is now promoting innovative activities at each plant under the guidance of a consultant for the Toyota Production System (TPS). This paper describes the innovative manufacturing activities undertaken at Fujitsu Component Limited (FCL), and then introduces Fujitsu IT Products Limited (FJIT) and the Fujitsu Nasu Plant (mobile system manufacturing), which are promoting innovative activities that began in April 2004 at their facilities under TPS consultant guidance. Finally, this paper examines related activities under way at Shimane Fujitsu Limited (SFJ), which has received guidance from a TPS consultant since April 2005.

Tags: Business Functions		   
whitepaper Intel's Silicon R&D Pipeline (High Bandwidth)0000-00-00 Intel
  Silicon technology is the foundation on which Intel's chips and platforms are built. Intel has a silicon R&D pipeline which produces a new process technology every two years, in accordance with Moore's Law. The presenter of this webcast will describe the current 90nm and 65nm process technologies, and the features being developed for 45nm and future technologies, to meet the power and performance requirements of future platforms.

Tags: Components		   
whitepaper Intel's Silicon R&D Pipeline (Low Bandwidth)0000-00-00 Intel
  Silicon technology is the foundation on which Intel's chips and platforms are built. Intel has a silicon R&D pipeline which produces a new process technology every two years, in accordance with Moore's Law. The presenter of this webcast will describe the current 90nm and 65nm process technologies, and the features being developed for 45nm and future technologies, to meet the power and performance requirements of future platforms.

Tags: Components		   
whitepaper Opportunities and Challenges of III-V Nanoelectronics for Future High-Speed, Low-Power Logic Applications2006-07-27 Intel
  This paper highlights the opportunities and challenges of III-V nanoelectronics for future high-speed, low-power digital logic applications. III-V materials in general have significantly higher electron mobility than Si and can potentially play a major role along with Si in future high-speed, lower-power computing. The major potential advantage of using a III-V quantum-well field-effect transistor as a logic transistor is that it can be operated under very low supply voltage(e.g., 0.5 V) and hence, lower power dissipation while still achieving very high speed. Compared to other emerging high-mobility materials, such as, carbon nanotubes and semiconductor nanowires, which require "Bottom-up" chemical synthesis for formation and suffer from the fundamental placement problem, III-V materials are far more practical in terms of patterning.

Tags: Components, Software Development Tools		   
whitepaper Gabriel Consulting Group: The Quest for Relentless Innovation2006-05-01 IBM
  Maximizing innovation is a hot topic today. Innovative firms lead markets in both product leadership and financial returns. This report from Gabriel Consulting Group discusses the need for innovation and explains how traditional business models may not provide enough innovation horsepower to keep up in an increasingly speedy business world. A new IBM unit is also examined: Technology Collaboration Solutions, which is geared to helping clients get ahead and stay ahead of the pack.

Tags: IT Budgeting, Components, Business Functions, Business Functions, IT Budgeting		   
whitepaper Collaborative Innovation in an Era of Open Standards2006-05-01 IBM
  In this white paper, IBM's Adalio Sanchez argues that the most conducive technology for collaborative innovation is open standards. He cites as evidence the indisputable success of Apache, Linux, and blades, all of which are based on open standards. Sanchez goes on to explain why the adoption of standards-based technologies is a sound business strategy that helps companies minimize time to market, reduce costs, generate differentiated offerings, and drive a business model for sustained growth.

Tags: Components, Business Functions, Business Functions, IT Budgeting		   
whitepaper Semiconductor industry solutions: Product and design innovation through collaboration2006-03-01 IBM
  As electronic systems rapidly evolve with many new features and functions, chipmakers continue to look for ways to innovate and gain competitive high ground. This has led to a huge increase in the complexity of designing products, raising the level of systems integration to new heights. To succeed, many companies are turning to the IBM Engineering & Technology Services (E&TS) group, which provides on-demand services to help them solve their toughest engineering issues. Download this white paper to learn more.

Tags: IT Budgeting, Components, Business Functions, Business Functions, IT Budgeting		   
whitepaper NANA: A Nano-Scale Active Network Architecture2006-02-09 Association for Computing Machinery
  This paper explores the architectural challenges introduced by emerging bottom-up fabrication of nanoelectronic circuits. The specific nanotechnology the paper explores proposes patterned DNA nanostructures as a scaffold for the placement and interconnection of carbon nanotube or silicon nanorod FETs to create a limited size circuit (node). Three characteristics of this technology that significantly impact architecture are limited node size, random node interconnection, and high defect rates. The paper presents and evaluates an accumulator-based active network architecture that is compatible with any technology that presents these three challenges. This architecture represents an initial, unoptimized solution for understanding the implications of DNA-guide self-assembly.

Tags: Components