According to the report, The Commercial Times said UMC will be issuing T$7.5 billion in five-year bonds at a coupon rate of 5.185 percent, and another T$7.5 billion in seven-year bonds at 5.285 percent. The debt is intended for funding the chipmaker's 12-inch wafer plant in Singapore, the paper said without elaborating. UMC and Germany's Infineon Technologies AG last December signed a memorandum of understanding to jointly invest US$3.6 billion in building a 12-inch wafer plant in Singapore.
Short Take: UMC to issue NT$15b bonds to finance S'pore venture
By Staff, Singapore.CNET.com, CNET.com
Monday, March 12, 2001 03:07 PM
Monday, March 12, 2001 03:07 PM
SINGAPORE--Taiwan's United Microelectronics Corp (UMC), the world's second largest microchip foundry, is planning to issue T$15 billion (US$460 million) in corporate bonds this April to finance its Singapore chip venture, said Reuters Saturday, citing a Taiwanese newspaper.
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