Doing more with less

The quest for more powerful processors has brought higher energy bills, a bigger load to cool, and the ever-present threat of overheating. Insufficient power and overheating are hot buttons for growing IT environments - in fact, power costs are quickly catching up with acquisition costs.

The drive for greater compute performance is incredibly important as the world's data is already outstripping our ability to compute it. Moving forward, HP and Intel are committed to providing eco-technology innovations that allow you to do more with less.

Intel processors: performance made efficient

Processors are at the heart of technology's progress, which makes processor efficiency a key aspect in achieving sustainability. Intel is delivering unprecedented innovations in processor architecture, silicon, platform technology and software to make performance energy-efficient.

Key Features

» Architecture Innovation:
Intel® Core™ microarchitecture builds computing headroom and performance enabling smaller footprint and power demands through power-conscious design features

» Silicon Innovation:
Intel's groundbreaking 45nm Hi-k metal gate process technology makes record-breaking processor speeds possible, while reducing the amount of electrical leakage

» Platform innovation:
Intel® multi-core platforms offer new capabilities and enhanced user benefits, ensuring that new systems can support high-end applications, especially in the data center

Download the whitepaper on Turning Challenges into Opportunities in the Data Center >>

HP Thermal Logic Technology

HP BladeSystem with built-in HP Thermal Logic technology gives you a powerful ally to overcome the power and cooling dilemma and keep your datacenter within your power budget.

Download this IDC whitepaper about the value of Thermal Logic technology and how HP can lower power and cooling costs to extend the life of your datacenter.

Key Features

» Cut your energy bill:
Use 20 to 46.5% less power per server than IBM BladeCenter-H

» Less hot air in the datacenter:
Less heat from less power, plus 31 to 60% less air pushed into the datacenter.

» Extend the life of your datacenter:
Power more servers for less energy and cooling

» Support full featured server blades:
Efficient design with capacity to support features equal to enterprise class 2

HP vs. the competition

HP blades use less energy than other leading competitors in the blade market. With built-in instrumentation, accurate monitoring and control, and the ability to pool, share and allocate the right amount of power and cooling to match your demand, HP Thermal Logic ensures your blade solution never wastes a watt of power or a gram of air.

Download this benchmark performance release that compares the power and cooling advantages of HP versus other systems.

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